Winbond selects 11.1 billion dollars to build a 300-millimeter factory
The Taiwanese company, Winbond Electronics, a manufacturer of specialized DRAM and flash memory of NOR type, intends to build a new factory, designed for 300-millimeter wafer. Construction should start in late second quarter or the middle of next year. The company will be located in Technopark KSP in the South Taivana
According to the company, the new factory will be commissioned by 2020.
Winbond plans to invest in the production of 11.1 billion dollars. Initially the factory will be busy with the release of a DRAM according to the norms of 20 and 25 nm. Over time, there can be used the norms of 14 nm or less.
The manufacturer announced plans to expand its 300-mm factory in Central Taiwan. By the end of the year, productivity should be increased from the current 44 000 plates per month to 48 000. And in 2018, the productivity is expected to increase to 53 000 inserts per month.