Western Digital releases the world’s first 64-layer 3D NAND chips density 512 GB

Western Digital has announced the start of pilot production of 64-layer 3D NAND chips (BiCS3) with a density of 512 GB. According to the manufacturer, the crystals with cells capable of storing three bits, are the first of its kind. Their mass production the company expects to begin in the second half.

In 2015, the company Western Digital was first mastered the production of 48-layer 3D NAND memory, and in 2016 — to 48-ply. The memory of both types available to customers. The new memory was developed jointly with Toshiba serving technology and production partner for Western Digital.

Source: Western Digital

Western Digital


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