TSMC, GlobalFoundries and Samsung will soon tell you about the 7-nanometer process technology
From 3 to 7 December in San Francisco will host a conference International Electron Devices Meeting (IEDM), where leading manufacturers of semiconductor products will talk about their developments in the field of 7-nanometer process technology.
IBM, Globalfoundries and Samsung have relied lithography using hard ultraviolet radiation (EUV). The use of EUV means a transition to a radiation source with much shorter wavelength in comparison with the currently used (13.5 nm versus 193 nm). In addition, this process uses strained silicon and compound of silicon and germanium. This simplifies the formation of very thin structures, but the difficulties faced by partners in the development process, suggests that earlier TSMC will begin commercial production of goods according to norms of 7 nm.
TSMC chose to finally choose the immersion potential of CMOS technology. According to the manufacturer, the transition to the norms of 7 nm will allow to triple the density of the arrangement of the transistor structures and to increase productivity by 35-40% or reduce power consumption by 65% compared to products made on 16-nanometer process technology. To trial the production of such products in TSMC expects to begin next year.
GlobalFoundries recently promised that the release of 7-nanometer products with the use of EUV lithography to the «key levels» to begin in 2018.
Intel is not yet talks about his achievements as part of the development of technological standards of 7 nm. Perhaps, at this stage, competitors will overtake perennial technology leader.
Source: CDR info