Tsinghua Unigroup expects to develop issue 18-nanometer DRAM memory and 64-layer 3D NAND memory

Company Tsinghua Unigroup, in January reported plans to invest $ 30 billion in the construction of a plant to produce memory chips, plans to master the production of 18-nanometer DRAM.

The Chinese state-private manufacturer is negotiating with the leading producers of these products, including Micron Technology and SK Hynix, on possible technological cooperation.

As you know, Tsinghua Unigroup expects in the coming years to enter the three largest manufacturers of semiconductor products. The company confirmed that until the end of the year should be prepared samples of 32-layer flash memory 3D NAND. In addition, planned development of 64-layer flash memory 3D NAND.

Source: CDR info

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