The Samsung Galaxy S9 attributed to reduced printed circuit Board and long life battery

Sources report that Samsung Electronics will start using new reduced PCB in the flagship smartphone Galaxy S9, which will be released early next year.


We are talking about the PCB, which will be an enhanced version of multilayer printed circuit boards of high density (High Density Interconnect — HDI). This innovation, according to rumors, Apple has already implemented in its new iPhone 8.


New, smaller printed circuit boards have a number of advantages, one of which is the possibility of installation in a housing the same size of high-capacity battery. After all, the operating time of a smartphone without recharging is the weakest point, which the last years are unable to improve the manufacturers.



At the moment, multilayer printed circuit Board high density Samsung put 10 producers. Of these, four companies have sufficient experience to start to produce a new PCB.


Advanced payments will be used in Galaxy S9 with a single-chip system Exynos family. Due to technical difficulties the smartphones, equipped with Qualcomm’s flagship SoC, not getting a new motherboard.

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