The quality of the thermal interface between the chip of the CPU and the heat-spreading lid processor Ryzen turned out great

Those who are actively involved in overclocking of computer components, know that Intel has for many years uses in their processors a bad thermal interface between the chip of the CPU and the heat-spreading lid.

«Scalping» of the processor with subsequent replacement of the thermal interface to some other often allows to lower the temperature in overclocking by 10 or more degrees. In connection with the release of AMD Ryzen, which showed itself well from the competition, the question arose about the quality of the thermal interface innovations.

It decided to check out enthusiast, hiding under the alias der8auer. He used Ryzen 7 1800X and Ereboss cooler Thermalright. Cover of the processor was removed with a special tool and factory solder was replaced by a liquid metal Thermal turbocompound Grizzly Conductonaut with thermal conductivity of 73 W/(m·K).

Before this procedure, the CPU was overclocked to the frequency of 3.9 GHz at a voltage of 1.4 V, the heat test in Prime95 to 81 degrees. Increasing the voltage and frequency to 1.45 V and 4.0 GHz respectively, the processor is eventually switched off due to overheating.

After replacing the thermal interface and install the cooler is directly on the crystal without the use of the lid, the temperature of the CPU at the same voltage and frequency was equal to 80 degrees. Win one degree in General, can be considered a measurement error. Conclusion — the quality of the solder under the CPU lid Ryzen great. The second conclusion — when using air cooling, unfortunately, it is not always possible to count on stable work at the frequency of 4.0 GHz.

Tags:
AMD

Comment

(Visited 37 times, 1 visits today)
No tags for this post.