Single-chip system Snapdragon 845 970 Kirin and will support UFS 2.1 and LPDDR4X

In the network appeared new details about Qualcomm Snapdragon SoC and HiSilicon Kirin 845 970. As stated, these system on a chip will be produced at 10-nanometer technology. And if the Kirin 970, in fact, confirmed the information, published six months ago, the Snapdragon 845 rumors recently attributed to the norms of 7 nm.

Another interesting point related to Snapdragon 845, is that for a high-performance Quad-core cluster CPU selected core ARM Cortex-A75, and not their own development Qualcomm. We will remind, at Kirin 970 this is the role of the ARM Cortex-A73. The cluster with low power consumption in both cases includes four core ARM Cortex-A53.

To total advances, according to the source, embodied in Kirin and Snapdragon 845 970, includes support for flash memory UFS 2.1 and memory LPDDR4X.

Both platforms will support LTE carrier aggregation with 5 x 20 MHz and 802.11 ac Wi-Fi, Snapdragon processor and 845 — and even 802.11 ad.

Source: WCCFtech.com

Tags:
Qualcomm
, HiSilicon

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