Australian scientists have figured out how to cut the silicene from the metal substrates

Miracle material graphene, often referred to as the successor of silicon at the stage when further development of microelectronics in the traditional way will run into physical barriers, is an alternative in the form of silicone. The silicene is similar to graphene two-dimensional allotropic connection, but built of silicon atoms, not carbon.

The attractiveness silicone due to the fact that with silicon microelectronics has been working for more than five decades, that is a potential compatibility with existing semiconductor manufacturing. In addition, the advantages Siliana include relatively low oxidation with oxygen and greater flexibility in comparison with graphene.

In 2015, was created field-effect transistors made out of silicene, which confirmed the prospectivity of the work in this direction. However a serious obstacle is the difficulty of obtaining silicone. The situation may change the development of scientists from the University of Wollongong in Australia, which said the source.

Researchers have developed a technology for the separation layer silicone (shown in pink) from the metal substrate on which it is grown.

Due to the small thickness silicone no mechanical methods are not effective.

The secret was to run under the silicene oxygen molecules (green), insulating it from the metal (upper layer of which is shown yellow), then the film silicona easily separated from the substrate.

The researchers injected oxygen molecules with a scanning tunneling microscope. According to participants of the project, in a vacuum chamber, oxygen molecules moving in a directed flow, cutting off the silicene with the substrate, like with scissors. Scientists believe that their achievement will make a revolution in the study silicone because it eliminates one of the major difficulties in obtaining it.

Source: IEEE Spectrum


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