At Purdue University have created a cooling system that includes the microchannels inside the chip

Researchers from Purdue University (Indiana, USA) presented the latest development, allowing to improve the cooling of semiconductor chips. Its essence — the circulation of coolant micro channels formed directly in the semiconductor crystal.

The development is made in the framework of the project, funded by DARPA and aimed at achieving the indicators of the efficiency of heat dissipation of 1 kW per 1 cm3, which is approximately an order of magnitude of the needs of processors of modern supercomputers.

The removal of heat from the interior of the crystal significantly increases the cooling efficiency, fundamentally eliminating the drawbacks of existing cooling systems in which heat is removed only from the surface of the crystal in contact with the heat spreader or heat sink.

The problem of increasing the efficiency of the heat sink has risen with a new sharpness in the transition to surround the chip layout as a new reserve for increasing the degree of integration.

University development uses a dielectric coolant, thereby eliminating the need to isolate the microchannels. The timing of introduction of mass products.


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