A single-chip system HiSilicon Kirin 970 will be produced at 10-nanometer process technology
System-on-chip Huawei HiSilicon Kirin 960 only had time to enter the market in the composition of the mobile Mate 9, as in the Network appeared the first information about the platform is Huawei’s next generation.
The source reports that Kirin 970 will be produced at 10-nanometer technology at the facilities of TSMC. Its development will be completed in the first quarter of next year. Of course, expect an appearance in smartphones is unlikely, given the recent announcement of Kirin 960. Recall that Kirin 960 is available for 16-nanometer standards.
About the configuration of the new data yet, but it is reported that the modem system on a chip will match the LTE Cat12 category. The emergence of new SoC Kirin, most likely, is expected only towards the end of next year.